Low temperature curing acrylate and maleimide based formulations and methods for use thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 22, 2011
Grant Date -
Mar 11, 2010
app pub date -
Apr 14, 2008
filing date -
Apr 16, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully