Defect analysis
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United States of America Patent
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Nov 22, 2011
Grant Date -
Jan 1, 2009
app pub date -
Jun 29, 2007
filing date -
Jun 29, 2007
priority date (Note) -
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Abstract
In one embodiment, a method to analyze a semiconductor wafer comprises extracting inline defect data from a data source, counting a total number of inline defects and end-of-line defects, terminating the analysis when the total number of inline defects and end-of-line defects exceeds a threshold, and mapping the inline defects onto the end-of-line defects when the total number of inline defects and end-of-line defects is less than a threshold.
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