Method and apparatus for cutting and cleaning wafers in a wire saw
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United States of America Patent
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Nov 29, 2011
Grant Date -
May 27, 2010
app pub date -
Jan 13, 2009
filing date -
Nov 25, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus of cutting and cleaning wafers in a wire saw is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a first top outlet and a second top outlet located in a top position with respect to a work piece for applying fluids during sawing, and at least one chute located substantially below the work piece for receiving the fluids, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluids flow in a vertical direction against and into the work piece for slicing and cleaning wafers.
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