Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
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United States of America Patent
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Nov 29, 2011
Grant Date -
Jun 21, 2007
app pub date -
Dec 21, 2005
filing date -
Dec 21, 2005
priority date (Note) -
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Abstract
An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.
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