Electrically conductive structure on a semiconductor substrate formed from printing
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United States of America Patent
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Nov 29, 2011
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N/A
app pub date -
Sep 3, 2008
filing date -
Sep 3, 2008
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Abstract
Provided are methods for forming an electrically conductive structure of a desired three-dimensional shape on a substantially planar surface of a substrate, e.g., a semiconductor wafer. Typically, the particulate matter is deposited in a layer-by-layer manner and adhered to selected regions on the substrate surface. The particulate matter may be deposited to produce a mold for forming the structure and/or to produce the structure itself. A three-dimensional printer with associated electronic data may be used without the need of a lithographic mask or reticle.
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