Wafer level package structure, and sensor device obtained from the same package structure
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United States of America Patent
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Nov 29, 2011
Grant Date -
Oct 29, 2009
app pub date -
Nov 24, 2006
filing date -
Nov 25, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.
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