Direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants
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United States of America Patent
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Dec 6, 2011
Grant Date -
Jun 10, 2010
app pub date -
Feb 12, 2010
filing date -
Feb 9, 2007
priority date (Note) -
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Abstract
A method for constantly controlling a direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants. The direct pressure is applied to an interface between the porous coating and the substrate material via a pressure application mechanism unaffected by heat and air pressure conditions of the bonding process. The pressure application mechanism maintains a pressure on the implant which is constantly controlled throughout the bonding process.
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