Microelectromechanical system package
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United States of America Patent
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Dec 6, 2011
Issued Date -
N/A
app pub date -
Feb 4, 2008
filing date -
Feb 6, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectromechanical system package includes a chip carrier, a first microelectromechanical system chip, a silicon cover, a layer of metal, a plurality of first bonding wires and a sealant. The first microelectromechanical system chip is positioned on the chip carrier and has an active surface, and an active area on the active surface. The layer of metal is formed on the upper surface of the cover. The first bonding wires electrically connect the active surface of the first microelectromechanical system chip to the chip carrier. The sealant is formed on the chip carrier to encapsulate the first microelectromechanical system chip and the first bonding wires.
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