Slurry for slicing silicon ingot and method for slicing silicon ingot using the same
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United States of America Patent
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Dec 13, 2011
Grant Date -
Feb 18, 2010
app pub date -
Oct 20, 2006
filing date -
Oct 20, 2006
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Abstract
The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder.
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