Method for producing electro-thermal separation type light emitting diode support structure
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United States of America Patent
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Dec 20, 2011
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app pub date -
Aug 27, 2010
filing date -
Aug 27, 2010
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Abstract
A method for producing an electro-thermal separation type light emitting diode support structure is provided. One of the embodiments for the support structure has at least two heat dissipation bases and at least two conductive supports which are coupled by a heat dissipation plate and a support plate. Another embodiment for the support structure has at least two heat dissipation bases and at least two conductive supports which are formed by a thick-thin plate. The light emitting diode chips of different types can be configured on the heat dissipation bases of these designs, respectively. Therefore, the invention achieves the goal of using different types of light emitting diode chips at the same time.
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