Image sensor and method for manufacturing the same
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United States of America Patent
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Dec 20, 2011
Grant Date -
Jul 2, 2009
app pub date -
Dec 26, 2008
filing date -
Dec 27, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An image sensor may include a first substrate having circuitry including wires and a silicon layer formed on and/or over the first substrate to selectively contact the wires. The image sensor may include photodiodes bonded to the first substrate while contacting the silicon layer and electrically connected to the wires. Each unit pixel may be implemented having complicated circuitry without a reduction in photosensitivity. Additional on-chip circuitry may also be implanted in the design.
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