US Patent No: 8,080,873
Number of patents in Portfolio can not be more than 2000
Semiconductor device, semiconductor package, and method for testing semiconductor device
Stats
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Dec 20, 2011
Issued date -
May 9, 2005
filing date -
11/124,262
serial no -
In Force
status
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Abstract
A semiconductor device designed to facilitate testing. Superimposed first and second semiconductor chips each include a plurality of internal terminals, an external terminal, and a plurality of transistors. A plurality of wires connect the internal terminals, the transistors, and the external terminals of the first and second semiconductor chips in series.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 6,831,502 Internal power-source potential supply circuit, step-up potential generating system, output potential supply circuit, and semiconductor memory | 3 | 1996 | |
| 6,441,669 Internal power-source potential supply circuit, step-up potential generating system, output potential supply circuit, and semiconductor memory | 5 | 2001 | |
| 6,473,321 Semiconductor integrated circuit and nonvolatile semiconductor memory | 29 | 2001 | |
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| 6,476,506 Packaged semiconductor with multiple rows of bond pads and method therefor | 55 | 2001 | |
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| 5,528,083 Thin film chip capacitor for electrical noise reduction in integrated circuits | 74 | 1994 | |
Patent Citation Ranking
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