RF shielding for a singulated laminate semiconductor device package
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United States of America Patent
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Dec 27, 2011
Grant Date -
N/A
app pub date -
Nov 24, 2010
filing date -
Nov 24, 2010
priority date (Note) -
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Abstract
A method for manufacturing a semiconductor device package to provide RF shielding. The device is mounted on a laminated substrate having conducting pads on its top surface. A molding compound covers the substrate top surface and encapsulates the devices. The substrate is disposed on a tape; the molding compound and the substrate are cut through, forming package units separated by the saw cut width and exposing a portion of a conducting pad. In an embodiment, the tape is stretched to widen the gap between package units. A conductive shield is applied to cover each package unit and to make electrical contact with the exposed conducting pad portion, thereby connecting to a ground trace beneath the device and providing RF shielding for the device. A single-unit molding process may be used, in which the conducting pad is exposed during and after molding.
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