Ring-shaped electrode and manufacturing method for same
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United States of America Patent
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Dec 27, 2011
Grant Date -
Oct 21, 2010
app pub date -
Apr 20, 2009
filing date -
Apr 20, 2009
priority date (Note) -
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Abstract
An electrode structure and a method for manufacturing an integrated circuit electrode includes forming a bottom electrode comprising a pipe-shaped member, filled with a conductive material such as n-doped silicon, and having a ring-shaped top surface. A disc-shaped insulating member is formed on the top of the pipe-shaped member by oxidizing the conductive fill. A layer of programmable resistance material, such as a phase change material, is deposited in contact with the top surface of the pipe-shaped member. A top electrode in contact with the layer of programmable resistance material.
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