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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
ALSEPHINA INNOVATIONS INC	303 TERRY FOX DRIVE SUITE 300 OTTAWA K2K 3J1

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Chapple-Sokol, Jonathan D	Essex Junction, US	23	1194
Delibac, Daniel A	Colchester, US	7	26
He, Zhong-Xiang	Essex Junction, US	178	1825
Lee, Tom C	Essex Junction, US	80	1171
Murphy, William J	North Ferrisburgh, US	170	2504
Sullivan, Timothy D	Underhill, US	138	1740
Thomas, David C	Richmond, US	36	720
Vanslette, Daniel S	Fairfax, US	24	129

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
December 27, 2011	US,8084864,B2   US8084864B2	GRANTED PATENT AS SECOND PUBLICATION
September 15, 2011	US,20110221064,A1   US20110221064A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 8084864

Electromigration resistant aluminum-based metal interconnect structure

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