Redistribution layer enhancement to improve reliability of wafer level packaging

United States of America Patent

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Aug 2, 2011
Grant Date
May 12, 2011
app pub date
Nov 10, 2009
filing date
Nov 10, 2009

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Abstract

An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.

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Patent Owner	Address
MAXIM INTEGRATED PRODUCTS INC	120 SAN GABRIEL DRIVE SUNNYVALE CA 94086

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Khandekar, Viren	Flower Mound, US	23	452
Rahim, S Kaysar	Dallas, US	1	37
Samoilov, Arkadii	Sartoga, US	10	604
Xu, Yong Li	Plano, US	4	109
Zhou, Tiao	Carrollton, US	27	307

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Redistribution layer enhancement to improve reliability of wafer level packaging

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12616077

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PATENT NO	8084871
APP PUB NO	20110108981A1
SERIAL NO	12616077
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
December 27, 2011	US,8084871,B2 US8084871B2	GRANTED PATENT AS SECOND PUBLICATION
May 12, 2011	US,20110108981,A1 US20110108981A1	FIRST PUBLISHED PATENT APPLICATION

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12616077

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