RF chip test method

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United States of America Patent

PATENT NO 8085059
APP PUB NO 20100123475A1
SERIAL NO

12356481

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Abstract

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An RF chip test method is disclosed. The RF chip test method includes disposing an RF chip within a chip socket, with the RF chip having at least one RF pin and at least one non-RF pin, the chip socket having conductive elements, and the conductive elements contacting the RF pin and the non-RF pin; connecting the non-RF pin to a ground end and connecting the RF pin to an RF measuring instrument; measuring a S11 parameter of the RF pin using the RF measuring instrument; and comparing the S11 parameter with an allowable range so as to judge the contact condition between the RF pin and the conductive element.

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Patent Owner(s)

Patent OwnerAddress
KING YUAN ELECTRONICS CO LTDNO 81 SEC 2 GONGDAOWU RD HSINCHU CITY 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsiu-Ju Hsin-Chu, TW 4 11
Ko, Hsuan-Chung Hsin-Chu, TW 5 21

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