Thin film capacitor and method of fabrication thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 3, 2012
Grant Date -
Oct 28, 2010
app pub date -
Apr 28, 2009
filing date -
Apr 28, 2009
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Methods for fabricating a capacitor are provided. In the methods, a dielectric may be formed on a metal (e.g. nickel) substrate, and a copper electrode is formed thereon, followed by the thinning of the metal substrate from its non-coated face, and subsequently forming a copper electrode on the thinned, non-coated face of the substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully