Substrate manufacturing apparatus, substrate manufacturing method, ball-mounted substrate, and electronic component-mounted substrate
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United States of America Patent
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Jan 10, 2012
Grant Date -
Aug 12, 2010
app pub date -
Feb 9, 2010
filing date -
Feb 10, 2009
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A substrate manufacturing apparatus manufactures a ball-mounted substrate and has a ball mounting apparatus which includes a ball vacuum chucking apparatus including a vacuum chucking head that carries out a vacuum chucking process to chuck balls at edges of inlets formed in a vacuum chucking surface and which mounts the balls vacuum-chucked by the vacuum chucking head on a substrate, the ball vacuum chucking apparatus further including: a holding vessel that holds the balls; and a vacuum chucking/holding unit that vacuum chucks and holds the balls held in the holding vessel on a front end thereof, and carrying out a supplying process that brings the vacuum chucking/holding unit that holds the balls on the front end thereof and the vacuum chucking surface of the vacuum chucking head relatively close to supply the balls to the vacuum chucking head while air is being drawn through the inlets.
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