Camera module with premolded lens housing and method of manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 10, 2012
Grant Date -
Dec 6, 2007
app pub date -
May 31, 2006
filing date -
May 31, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A novel digital camera module includes an image capture device, a circuit substrate, a lens unit and a housing that is mounted to the circuit substrate before the image capture device is mounted to the circuit substrate. In one particular embodiment, the housing is formed onto the circuit substrate via molding. The housing includes a bore to receive the lens unit, with the diameter of the bore being larger than the diagonal of the image capture device such that image capture device can be mounted to the circuit substrate through the bore. In another particular embodiment, the circuit substrate includes an aperture so as to facilitate the flip-chip bonding of the image capture device. The order in which the image capture device and the housing are coupled to the circuit substrate helps prevent damage to the image capture device during the mounting of the housing to the circuit substrate.
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