Compositions and methods for modifying a surface suited for semiconductor fabrication
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United States of America Patent
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Jan 10, 2012
Grant Date -
Jan 31, 2008
app pub date -
Aug 15, 2007
filing date -
Apr 30, 1997
priority date (Note) -
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Abstract
greater than 7. In certain embodiments, the pH buffer includes a basic pH adjusting agent and an acidic complexing agent, and the working liquid exhibits a pH from about 7 to about 12. In further embodiments, the disclosure provides a fixed abrasive article comprising a surfactant suitable for modifying the surface of a wafer, and a method of making the fixed abrasive article. Additional embodiments describe methods that may be used to modify a wafer surface.
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