Laser cutting apparatus and laser cutting method
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United States of America Patent
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Jan 10, 2012
Issued Date -
N/A
app pub date -
Nov 15, 2005
filing date -
Nov 19, 2004
priority date (Note) -
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Abstract
A laser cutting apparatus and a laser cutting method are provided which are adapted to concentrate laser light into a silicon substrate to produce a plurality of internal cracks. A light concentrating position, to which laser beams included in the laser light are concentrated, is temporally and spatially displaced to appropriately change lengths of the cracks according to positions in a direction of depth of the substrate. Consequently, the lengths of the internal cracks are controlled to surely lead a crack opening, the starting point of which is the internal crack formed by laser processing, to a predetermined cutting line on a surface of the substrate.
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