Chip socket assembly and chip file assembly for semiconductor chips
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Jan 17, 2012
Grant Date -
Jan 19, 2006
app pub date -
Sep 20, 2005
filing date -
May 26, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The socket releasably couples a packaged integrated circuit to a circuit board. The socket includes a clamp, a latch, and an array interconnect. The clamp is configured to be pivotally coupled to a circuit board. The latch is configured to be coupled to the circuit board and configured to releasably hold the clamp in a predetermined position. The array interconnect configured to be coupled to the printed circuit board. In use the latch releasably holds the hinged clamp in the predetermined position to clamp both a packaged integrated circuit between the clamp and the array interconnect, and the array interconnect between the packaged integrated circuit and the circuit board.
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