MEMS device and interconnects for same
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United States of America Patent
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Jan 17, 2012
Grant Date -
Aug 12, 2010
app pub date -
Apr 21, 2010
filing date -
Dec 20, 2006
priority date (Note) -
Expired
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Abstract
A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.
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