Electronic package structure having conductive strip and method
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United States of America Patent
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Jan 17, 2012
Grant Date -
May 20, 2010
app pub date -
Jan 26, 2010
filing date -
Feb 16, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic package structure and method use a conductive strip to bond die-to-die, die-to-lead, chip carrier-to-lead, or lead-to-lead. A conductive strip may carry greater current than a bonding wire, and thus may replace several bonding wires. The bonding of the conductive strip may be carried out by an SMT process, and thus requires lower cost than wire bonding processes. A conductive strip may be bonded to more than two dice or leads to save more bonding wires. A conductive strip is stronger than a bonding wire, and thus lowers the possibility of being broken.
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