Semiconductor chip fabrication method
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United States of America Patent
Stats
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Jan 24, 2012
Grant Date -
Aug 20, 2009
app pub date -
Feb 18, 2009
filing date -
Feb 20, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor chip fabrication method including a modified layer forming step of applying a laser beam having a transmission wavelength to the semiconductor wafer from the back side of the semiconductor wafer along the streets formed on the front side of the semiconductor wafer so that a focal point of the laser beam is set inside the semiconductor wafer, thereby forming a modified layer in the semiconductor wafer along each street, a metal film deposition step of depositing a metal film on the back side of the semiconductor wafer after the modified layer forming step, a semiconductor wafer attaching step of attaching the semiconductor wafer to an adhesive tape supported to an annular frame, and a semiconductor wafer dividing step of applying an external force to the semiconductor wafer in the condition where the semiconductor wafer is attached to the adhesive tape to thereby divide the semiconductor wafer with the metal film into the individual semiconductor chips along the modified layer formed along each street.
First Claim
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International Classification(s)
Cited Art Landscape
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| * 2008/0153,264 Wafer dividing method | 5 | 2008 | |
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| * 2008/0233,712 METHOD OF MANUFACTURING DEVICE | 6 | 2008 | |
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| * 2007/0275,543 Manufacturing method of a semiconductor device | 8 | 2007 | |
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| * 7807507 Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package | 5 | 2009 | |
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