US Patent No: 8,101,504

Number of patents in Portfolio can not be more than 2000

Semiconductor chip fabrication method

ALSO PUBLISHED AS: 20090209088

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Abstract

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A semiconductor chip fabrication method including a modified layer forming step of applying a laser beam having a transmission wavelength to the semiconductor wafer from the back side of the semiconductor wafer along the streets formed on the front side of the semiconductor wafer so that a focal point of the laser beam is set inside the semiconductor wafer, thereby forming a modified layer in the semiconductor wafer along each street, a metal film deposition step of depositing a metal film on the back side of the semiconductor wafer after the modified layer forming step, a semiconductor wafer attaching step of attaching the semiconductor wafer to an adhesive tape supported to an annular frame, and a semiconductor wafer dividing step of applying an external force to the semiconductor wafer in the condition where the semiconductor wafer is attached to the adhesive tape to thereby divide the semiconductor wafer with the metal film into the individual semiconductor chips along the modified layer formed along each street.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
DISCO CORPORATIONTOKYO395

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagasawa, Tadato Tokyo, JP 10 13

Cited Art Landscape

Patent Info (Count) # Cites Year
 
DISCO CORPORATION (1)
2008/0233,712 METHOD OF MANUFACTURING DEVICE 4 2008
 
RENESAS ELECTRONICS CORPORATION (1)
2007/0275,543 Manufacturing method of a semiconductor device 5 2007
 
SAMSUNG ELECTRONICS CO., LTD. (1)
7,807,507 Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package 2 2009
 
Other [Check patent profile for assignment information] (1)
2008/0153,264 Wafer dividing method 3 2008

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