Semiconductor device and method of fabricating the same
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United States of America Patent
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Jan 24, 2012
Grant Date -
Nov 18, 2010
app pub date -
Jul 30, 2010
filing date -
Jun 3, 2008
priority date (Note) -
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Abstract
A semiconductor device is disclosed. The semiconductor device includes: a first electrode, disposed over a first region of a substrate; and a conductive layer, disposed over the substrate, including a second electrode disposed above the first electrode, wherein the second electrode comprises a mesh main part having a plurality of openings, and a plurality of extending parts, wherein the extending parts are connected to the mesh main part at periphery of the openings and extend toward a surface of the first electrode.
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