Integrated circuit package
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United States of America Patent
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-
Jan 24, 2012
Grant Date -
Aug 19, 2010
app pub date -
Apr 27, 2010
filing date -
May 20, 2003
priority date (Note) -
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Abstract
Two integrated circuits having circuitry on one of their major surfaces are ground on their opposite major surfaces to reduce their thickness. The ground integrated circuits are then adhered together to form a composite body and placed in a chamber formed within a substrate such as a printed circuit board. Electrical connections are formed between contacts of the integrated circuits and contacts of the substrate. Components may be mounted on the outer surfaces of the substrate.
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