Bonded wafer structure and method of fabrication
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United States of America Patent
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Jan 24, 2012
Grant Date -
Apr 22, 2010
app pub date -
Oct 20, 2008
filing date -
Oct 20, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of packaging electronics comprises providing a first wafer and providing a second wafer. The method also comprises depositing a polymer material over a surface of the first wafer; and selectively removing a portion of the polymer from the first wafer to create a void in the polymer. The method also comprises placing the first wafer over the second wafer and in contact with the polymer; and curing the polymer to bond the first wafer to the second wafer. A bonded wafer structure is also described.
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