US Patent No: 8,102,668
Number of patents in Portfolio can not be more than 2000
Semiconductor device package with internal device protection
Stats
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Jan 24, 2012
Issued date -
May 6, 2008
filing date -
12/115,761
serial no -
In Force
status
Importance
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Abstract
An integral impedence is formed on or within a lead frame pin of a semiconductor package and receives a connection from an electrode of a semiconductor die within the package to eliminate the need for adjustment and protective impedences external of the package. The impedence comprises passives such as resistors, capacitors, diodes or inductors which modify the performance of the package for new semiconductor device characteristics. The impedences may have positive or negative temperature coefficients and are in close thermal communication with the semiconductor die.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 6,903,921 Chip-type solid electrolytic capacitor superior in productivity and reliability thereof | 22 | 2004 | |
| 6,975,503 Chip type solid electrolytic capacitor having plated fillet surface and method of manufacturing the same | 14 | 2004 | |
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| 2003/0045,032 Leadframe, method of manufacturing the same, semiconductor device using the same, and method of manufacturing the device | 15 | 2002 | |
| 2004/0046,237 Lead frame and method of manufacturing the same | 16 | 2003 | |
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| 5,877,672 Resistor and resistor manufacturing method | 2 | 1997 | |
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| 5,309,014 Transistor package | 17 | 1992 | |
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| 2008/0186,008 Semiconductor device with inductor | 2 | 2007 | |
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| 6,473,291 Low inductance four terminal capacitor lead frame | 34 | 2001 | |
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| 5,546,048 Amplifier and display apparatus employing the same | 18 | 1993 | |
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| 5,028,983 Multilevel integrated circuit packaging structures | 38 | 1988 | |
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| 7,332,814 Bondwire utilized for coulomb counting and safety circuits | 1 | 2005 | |
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| 6,356,774 Oximeter sensor with encoded temperature characteristic | 181 | 1999 | |
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| 5,534,788 Integrated resistor for sensing electrical parameters | 20 | 1994 | |
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| 6,294,826 Molded electronic component having pre-plated lead terminals and manufacturing process thereof | 7 | 2000 | |
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| 6,300,617 Magnetic digital signal coupler having selected/reversal directions of magnetization | 26 | 1999 | |
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| 2007/0278,516 Semiconductor device and power source unit using the same | 10 | 2007 | |
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| 4,259,676 Thermal print head | 6 | 1979 | |
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| 4,818,895 Direct current sense lead | 21 | 1987 | |
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| 4,945,445 Current sense circuit | 24 | 1988 | |
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| 6,150,714 Current sense element incorporated into integrated circuit package lead frame | 17 | 1998 | |
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| 7,489,022 Radio frequency over-molded leadframe package | 2 | 2005 | |
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| 5,103,283 Packaged integrated circuit with in-cavity decoupling capacitors | 66 | 1990 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jul 24, 2015 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 24, 2019 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 24, 2023 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |