Semiconductor device package with internal device protection
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United States of America Patent
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Jan 24, 2012
Grant Date -
Nov 12, 2009
app pub date -
May 6, 2008
filing date -
May 6, 2008
priority date (Note) -
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Abstract
An integral impedence is formed on or within a lead frame pin of a semiconductor package and receives a connection from an electrode of a semiconductor die within the package to eliminate the need for adjustment and protective impedences external of the package. The impedence comprises passives such as resistors, capacitors, diodes or inductors which modify the performance of the package for new semiconductor device characteristics. The impedences may have positive or negative temperature coefficients and are in close thermal communication with the semiconductor die.
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