Method of fabricating multi-layered substrate
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United States of America Patent
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Jan 31, 2012
Grant Date -
Mar 4, 2010
app pub date -
Aug 27, 2008
filing date -
Aug 27, 2008
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Abstract
The present invention directs to fabrication methods of single-sided or double-sided multi-layered substrate by providing a lamination structure having at least a core structure and first and second laminate structures stacked over both surfaces of the core structure. The core structure functions as the temporary carrier for carrying the first and second laminate structures through the double-sided processing procedures. By way of the fabrication methods, the production yield can be greatly improved without increasing the production costs.
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