Leadframe for leadless package, structure and manufacturing method using the same
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United States of America Patent
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Jan 31, 2012
Grant Date -
Jun 9, 2011
app pub date -
Jan 28, 2011
filing date -
Apr 20, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.
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