Methods of forming stacked semiconductor devices with a leadframe and associated assemblies
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United States of America Patent
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Jan 31, 2012
Grant Date -
Nov 20, 2008
app pub date -
May 16, 2007
filing date -
May 16, 2007
priority date (Note) -
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Abstract
A device is disclosed which includes a first packaged integrated circuit device, a second packaged integrated circuit device positioned above the first packaged integrated circuit device and a plurality of planar conductive members conductively coupling the first and second packaged integrated circuit devices to one another. A method is also disclosed which includes conductively coupling a plurality of extensions on a leadframe to each of a pair of stacked packaged integrated circuit devices and cutting the leadframe to singulate the extensions from one another.
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