Laser cutting method
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United States of America Patent
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Feb 7, 2012
Issued Date -
N/A
app pub date -
Nov 14, 2005
filing date -
Nov 26, 2004
priority date (Note) -
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Abstract
At least one exemplary embodiment is directed to a laser cutting method where a laser beam is condensed at internal points inside a substrate forming processing regions, and where the laser is swept along a cutting line, where the cutting line is associated with a recess on the substrate and where the recess can be formed contemporaneously with the formation of the processing regions.
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