MEMS component and method for production
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United States of America Patent
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Feb 7, 2012
Grant Date -
Jun 17, 2010
app pub date -
Dec 18, 2009
filing date -
Jun 20, 2007
priority date (Note) -
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Abstract
A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.
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