Method for manufacturing multilayer wiring board
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United States of America Patent
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-
Feb 14, 2012
Grant Date -
May 15, 2008
app pub date -
Sep 29, 2005
filing date -
Dec 3, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.
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