Method for producing electronic components
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United States of America Patent
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Feb 14, 2012
Grant Date -
Mar 22, 2007
app pub date -
Nov 22, 2006
filing date -
Aug 24, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In order to achieve an integration of functional structures into the housing of electronic components, provision is made of a method for producing an electronic component comprising at least one semiconductor element having at least one sensor-technologically active and/or emitting device on at least one side, the method comprising the following steps: provision of at least one die on a wafer, production of at least one patterned support having at least one structure which is functional for the sensor-technologically active and/or emitting device, joining together of the wafer with the at least one support, so that that side of the die which has the sensor-technologically active and/or emitting device faces the support, separation of the die.
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