Method of electrically connecting a microelectronic component
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United States of America Patent
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Feb 14, 2012
Grant Date -
Sep 24, 2009
app pub date -
Mar 23, 2009
filing date -
Dec 29, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of treating a component can include providing a component including a plurality of metallic posts extending generally parallel to one another. The providing step can be performed so that the posts have solder on the tips of the posts but not covering other portions of the posts. The method can include reflowing the solder provided on the posts so that the solder coats the posts. The providing step may be performed so that, prior to the reflowing step, the solder covers only the tips of the posts. The providing step can include depositing portions of the solder on a surface of a metallic sheet and etching the sheet from the surface. The plurality of posts may comprise elongated posts.
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