Storage medium and semiconductor package
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United States of America Patent
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Feb 14, 2012
Grant Date -
Sep 3, 2009
app pub date -
Feb 26, 2009
filing date -
Feb 29, 2008
priority date (Note) -
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Abstract
A semiconductor package includes a semiconductor chip formed with a non-volatile semiconductor memory, a resin encapsulation that encapsulates the semiconductor chip, electrodes in a lattice (solder balls) formed and arrayed in a lattice on a bottom surface of the resin encapsulation. The solder balls include a signal electrode formed within the central region of the array and a dummy electrode formed outside the signal electrode.
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