Microspring array having reduced pitch contact elements

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United States of America Patent

PATENT NO 8115504
APP PUB NO 20100141290A1
SERIAL NO

12339919

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Abstract

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Embodiments of microspring arrays and methods for fabricating and using same are provided herein. In some embodiments, a microspring array may include at least two lithographically formed resilient contact elements, each resilient contact element having a beam and a tip for contacting a device to be tested, wherein the beams extend in substantially the same direction relative to a first end of the beams, and wherein the ends of the at least two beams are separated by a distance defining a central region and wherein the respective tips of the at least two beams extend away from the beams in a non-zero, non-perpendicular direction into the central region.

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Patent Owner(s)

  • FORMFACTOR, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gritters, John K Livermore, US 23 276

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