Process for forming an isolated electrically conductive contact through a metal package
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United States of America Patent
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Feb 21, 2012
Grant Date -
Jun 9, 2011
app pub date -
Feb 14, 2011
filing date -
May 25, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of forming an isolated electrically conductive contact through a metallic substrate includes creating at least one via through the substrate, where the via includes a first opening in a top surface of the substrate, a second opening in an opposing bottom surface and at least one continuous sidewall extending therebetween. A dielectric sleeve is formed on the at least one sidewall of the via while preserving at least a portion of the through via. An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.
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