Glass thick film embedded passive material
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United States of America Patent
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Feb 21, 2012
Grant Date -
Apr 1, 2010
app pub date -
Sep 29, 2008
filing date -
Sep 29, 2008
priority date (Note) -
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Abstract
A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.
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