Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof
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United States of America Patent
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Feb 21, 2012
Issued Date -
N/A
app pub date -
Jun 17, 2009
filing date -
Jun 17, 2009
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.
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