Integrated package circuit with stiffener
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United States of America Patent
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Feb 21, 2012
Issued Date -
N/A
app pub date -
Apr 28, 2008
filing date -
Aug 31, 2006
priority date (Note) -
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Abstract
An integrated circuit package employs a stiffener layer that houses a passive electronic component to maintain mechanical properties when a thinner substrate is used. The use of either a retention wall or a stiffener allows for the manufacture of these integrated circuit package using strip, matrix, or array technology where a larger board with a plurality of integrated circuit packages is produced industrially and then cut to individual units.
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