Sensing circuit board communications module assembly
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United States of America Patent
Stats
-
Feb 21, 2012
Grant Date -
Dec 24, 2009
app pub date -
Jun 18, 2008
filing date -
Jun 18, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Methods, devices, and systems for electronic wireless communication in circuits for monitoring one or more activities of an individual are disclosed. One circuit board assembly embodiment includes a carrier board portion having a module contact pattern to electrically connect a module, selected from a plurality of different module types each having a contact pattern that corresponds to the module contact pattern of the carrier board portion, to a number of electrical components attached to the carrier board portion; a sensor portion for sensing one or more activities of an individual, the sensor portion electrically connected to the carrier board portion; and a communications module portion selected from the plurality of different module types, wherein the module portion has a contact pattern that corresponds to the module contact pattern and wherein the communications module portion is electrically connected to the carrier board portion via the module contact pattern.
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