Method for forming sputter target assemblies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 28, 2012
Grant Date -
Dec 1, 2005
app pub date -
May 25, 2004
filing date -
May 25, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, attaches the insert to the backing plate and forms at least one cooling channel between the insert and the backing plate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully