Method for bonding components of medical devices
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United States of America Patent
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Feb 28, 2012
Grant Date -
Jun 18, 2009
app pub date -
Dec 11, 2008
filing date -
Dec 13, 2007
priority date (Note) -
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Abstract
A method of bonding a first component of a medical device to a second component of the medical device, where at least one of the components comprises a shape memory material, includes positioning the components in close proximity to each other to obtain an assembled configuration, and heating the assembled configuration at a temperature in the range of from about 800° C. to about 1100° C. to obtain a diffusion bond at a region of contact between the two components. The assembled configuration is formed into a desired set shape and heat-set at a temperature in the range of from about 350° C. to about 550° C. to impart a memory of the desired set shape to the shape memory materials without substantially impairing the diffusion bond.
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