Electrolytic copper process using anion permeable barrier
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United States of America Patent
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Feb 28, 2012
Grant Date -
Mar 29, 2007
app pub date -
May 3, 2006
filing date -
Apr 13, 1999
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Abstract
Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
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