Method and system for packaging a display
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United States of America Patent
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Feb 28, 2012
Grant Date -
Apr 13, 2006
app pub date -
Jun 10, 2005
filing date -
Sep 27, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.
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