Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
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United States of America Patent
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Feb 28, 2012
Grant Date -
Sep 4, 2008
app pub date -
Dec 26, 2007
filing date -
Dec 27, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.
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